Ki Jin Han; Madhavan Swaminathan

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KI JIN HAN; MADHAVAN SWAMINATHAN
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Design and Modeling for 3D IC's and Interposers

Design and Modeling for 3D IC's and Interposers

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a...
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